This article is from wechat
public number: Guojun Industry Research (ID: industryRCofG), author:
Xiao Jie, Bao Yanxin, original title: "Advanced packaging industry chain
depth report (2) - Packaging substrate materials contain development
opportunities, leading enterprises show growth potential", caption from:
Vision China
This
paper introduces the important position of packaging substrate in
packaging materials, and the development trend of packaging substrate
materials to high-end. The paper also discusses the layout and
challenges of domestic enterprises in the field of packaging substrate
materials.
• Packaging substrate occupies a key position in
packaging materials, which puts forward higher requirements for
packaging technology.
• Packaging substrate materials to high-end
march, domestic enterprises in the core resin and photoresist and other
fields have made breakthroughs.
• High-end copper foil and
ceramic substrate are important areas in packaging substrate materials,
and domestic enterprises are trying to catch up with international
leaders.
First,
the packaging substrate is the key to advanced packaging and domestic
replacement, and the material industry chain is extended to the high-end
1.
The packaging substrate accounts for the highest proportion of
packaging materials and occupies a key position in flip packaging
Narrow packaging is mainly for
first-level packaging, and packaging materials evolve to high standards.
Semiconductor packaging is the last step in the semiconductor
manufacturing process, providing electrical interconnection, mechanical
support, mechanical and environmental protection and thermal
conductivity channels between the chip and the printed circuit board.
The generalized package is
mainly divided into zero-level to four-level package, zero-level package
refers to the interconnection on the chip, the chip is obtained, the
first-level package, that is, the narrow sense of the package, refers to
the chip is fixed on the package substrate or lead frame, the chip pad
and the package substrate or lead frame of the inner pin interconnection
to further connect with the external pin, and the chip and the Internet
for protective encapsulation.
The secondary package is board
level package, that is, the printed circuit board is obtained. A
tertiary/quaternary package will result in a complete electronic
product. At present, integrated circuit chips are developing in the
direction of large size, high integration, small feature size and high
IO, so higher requirements are put forward for packaging technology,
which is inseparable from the performance improvement and cost reduction
of packaging materials. At present, packaging materials are developing
in the direction of high thermal conductivity, high mechanical strength,
high adhesion, low water absorption and low stress, promoting the
continuous progress of advanced packaging.